期刊名：<b>IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C</b>/issn:1083-4400 <button onclick='javascrip:history. back()'>返回列表</button><br><br>Continued by:<a href='jlist.php?journalName=IEEE Transactions on Electronics Packaging Manufacturing

'>IEEE Transactions on Electronics Packaging Manufacturing

</a>[1521-334X]

<br><table><tr bgcolor=#009a31><td>收入的数据库</td><td>查看文献题录（留空直达期刊首页）</td><td>收入起止年份</td></tr><tr><td>IEEE/IET Electronic Library (IEL) Journals</a></td><td><form method=post action=jlist.php target=_blank><input type=hidden name=action value=articlelink><input type=hidden name=avid value=81267><input type=hidden name=jid value=61366>卷号:<INPUT name=jvolume  size=4>,首页页码:<INPUT name=spage size=4><input type=submit value='查看期刊原文'></form></td><td> Available from 1996 volume: 19 issue: 1 until (and including) 1998 volume: 21 issue: 4 </td></tr><tr><td colspan=3 bgcolor=#009a31 height=2></td></tr></table>